enderfall wrote:Yes, this is exactly what I'm interested in. As I alluded to in my first post, I'm curious what the ramifications of using leaded solder to reball will have considering it has a significantly lower melting point than lead free solder. The PS3 developed the YLOD due to the heating up and cooling of the existing (lead free) solder. Doesn't that imply that the higher melting point solder is actually melting and thus subject to the expansion and contraction of the solder and causing the YLOD? In that case, wouldn't using solder with a lower melting point make the issue worse?Whatever wrote:Reball- The Graphics processor is removed from the motherboard. The solder is cleaned off.
Then with templates you line up about 1,300 micro (.6mm) solder balls on the processor. These are welded to the GPU and soldered back onto the motherboard.
---Should last years if done right.
There are no ramifications for using leaded solder. It is flat out superior. The only reason the unleaded solder is used, is because it is illegal to manufacture "toys" with lead.
The unleaded solder is brittle and fractures when it gets really hot then cools.
Your console will not get anywhere near running at 187 degrees.
Gonna be interesting to see what all these engineers do for the next gen consoles.